GAM 70 Solder thickness checker

All operation are easy and using Window’s interface in Chinese/English version.
Survey the thickness of tin solder by automatically or manually.
Survey the length and width manually, and the gap of tin solder.
Calculate the measure of area, the measure of cross-section and the measure of volumn automatically.
All surveyed values can be recorded to a file and be printed to a report.
Provide the diagrams of thickness distribution and control diagrams of X_BAR_R.
Calculate manfacture ability degree automatically (Cp,Cpk,Cpm).
It can have separate record according to every different production line.
It can adjust focal distance in different thickness of PC boards.
It can be called to sample periodically.

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【Function】
Surveying the thickness of printing tin solder, length, height and gap.
Provide the references of thickness distribution values.
Provide the analysis of different measure of cross-section.
Calculate the measure of area and volumn automatically in object which to be surveyed.
Provide all diagrams of statistics and analysis.
Provide X Control Diagram, R Control Diagram and Thickness List Diagram.
Provide X Average Control Diagram, Single Point List Diagram.

【Application】
Get the results of statistics and analysis about all surveyed values in every thickness degree.
Inspect the quality of solder printing process.
Survey the thickness of tin solder.
Measure the dimension of tin solder.
Provide thickness and dimension measurement function for other objects.

GAM 70 Solder thickness checker

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